About: Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry

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About: Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry Goto Sponge NotDistinct Permalink

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scientific article published on 20 December 2019

Attributes	Values
rdf:type	Item
description	wetenschappelijk artikel (nl) article scientifique publié en 2019 (fr) artículu científicu espublizáu n'avientu de 2019 (ast) scientific article published on 20 December 2019 (en) наукова стаття, опублікована 20 грудня 2019 (uk)
publication date	wds:Q92144193-DBA14E84-CEBF-4AB8-A998-7B5252442D3D
publication date	2019-12-20 00:00:00Z (xsd:dateTime)
author name string	wds:Q92144193-24D6C91D-BAE1-4C15-B1DF-4CA31FDBEFA9 wds:Q92144193-4CDFED27-817C-4F68-A635-E64C235056AE wds:Q92144193-B9A87799-6551-44B1-866A-682B0A0252AE wds:Q92144193-E6C02497-2BCA-4C2C-B2C1-9CB0955ECD86
author name string	M Tulej R Wiesendanger V Grimaudo R Lukmanov
rdfs:label	Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry (en) Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry (nl)
skos:prefLabel	Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry (en) Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry (nl)
name	Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry (en) Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry (nl)
author	wds:Q92144193-32AAB97A-7A8D-48FB-903D-6D8D26E699F4 wds:Q92144193-446C912C-5C25-48E9-A04F-32CB9B0D7DC3 wds:Q92144193-4AC168C6-32FA-4DFB-A003-0EB37D27C6E8 wds:Q92144193-64FE9751-2BD0-402F-B3BC-D00DDED8D552 wds:Q92144193-7E5204F2-A453-4A21-9FC5-88C6D1961C04 wds:Q92144193-88727C28-C6FC-40F6-AADC-6BFE6D1B705B
author	Peter Wurz Andreas Riedo Emanuel Lörtscher Peter Broekmann Pavel Moreno-García Alena Cedeño López
title	wds:Q92144193-8916C779-460C-409F-AFBD-96FE61589B21
title	Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry (en)
page(s)	wds:Q92144193-EEE8ACF5-4A53-48FE-A66E-F83D7E1E2E44
page(s)	1355-1362
instance of	wds:Q92144193-8D201FDF-64AD-4AE4-A44C-08AA7E1F3814
instance of	scholarly article
main subject	wds:Q92144193-E45C4945-A1B7-4525-9ECA-63DC092D891F
main subject	femtosecond laser
PubMed ID	wds:Q92144193-2D608164-9931-4AE8-822B-2BE147AB7B71
PubMed ID	http://rdf.ncbi.nlm.nih.gov/pubchem/reference/31859483
PubMed ID	31859483
published in	wds:Q92144193-92AA3D29-372A-47C5-BE82-351969D8BD72
published in	Analytical Chemistry
issue	wds:Q92144193-C3A20A1B-976D-42F3-9538-ED8155BEB0B1
volume	wds:Q92144193-C9209B71-9FBC-4EE8-87CE-077DF1B93156
issue	1
volume	92
DOI	wds:Q92144193-31F68BD9-7211-4B2D-B7AF-523CB6F6FA0B
DOI	http://dx.doi.org/10.1021/ACS.ANALCHEM.9B04530
DOI	10.1021/ACS.ANALCHEM.9B04530
is about of	https://www.wikidata.org/wiki/Special:EntityData/Q92144193

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